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With the development of China's optical communication industry,higher requirements for dimensional inspection have been put forward for
multi-core high-density connectors(such as MPO and MT), the core pitch of FA fiber arrays, and the pitch of VG V-groove substrates.Traditional measurement methods are inefficient and lack sufficient accuracy, while this equipment can perform automatic measurement with a repeat accuracy of ≤0.1 μm, effectively solving this problem. The equipment is available in two models: YGN-590-FAVG and YGN-590-MT. Using our equipment for inspection can significantly improve the accuracy of optical fiber connections. It has a wide range of application fields, including the optical communication industry and the semiconductor industry.
Product Features
(1) integrates image recognition and laser interferometry to creat a dual measurement engine.
(2) boasts a measurement resolution of 0.001 μm,meeting micro-level inspection requirements.
(3) supports multiple optical communication component standards,offering a wide range of applications.
(4) equipped with a three-axis precision mobile platform,easily handing small components.
(5) adopts a high-resolution industrial-grade CMOS,ensuring clear and stable imaging.
(6) features a modular design and user-friendly software interface,facilitating operation and maintance.
(1) equipment models:YGN-590-MT;YGN-590-FAVG
(2) test objects:MT;MPO;MT fiber assy;FA(Fiber Array);VG(V-Groove Substrate);V Groove
(3) test resolution:0.001 μm
(4) repeatability test: 3σ ≤ 0.1μm
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